Salient Features
- Scheme has Three components: Chip Design infrastructure support ( India Chip Centre in C-DAC ), Product Design Linked Incentive, and Deployment Linked Incentive
- Beneficiaries: Semiconductor design for Integrated Circuits (ICs), Chipsets, System on Chips (SoCs), Systems & IP Cores and semiconductor-linked design
- Implementing Agency: C-DAC (Centre for Development of Advanced Computing), operating under MeitY